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Pulsed DC Magnetron Sputter : EnerPulse & PulseGen series which applications are Al, Cu, Ti, Cr, Ni, Si, ITO, Graphite, TiN, ZnO, SiO2, Al2O3. High resistive materials can be used such as silicon deposition process. This is a power supply used to increase surface energy during operation in order to improve adhesiveness and uniformity. It is often used for etching, glow discharge, and bias uses. This device divides into DC and pulse switches, and is mainly used during arc ion plating processes and during sputtering processes.
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